This article will focus on multi-chip module (MCM) design which relates to System in Package (SiP) technology. This kind of electronic circuit board design has created an enormous market which will see lots of change over the next decade in electronics devices. Originally circuit board…
Tag: Circuit Board
Glass has been found to be a known good substrate material. It is commonplace for it to be used in circuit board design in order to achieve efficient results. It goes hand-in-hand with system in package technology which is also making advances in efficiency for…