This article will focus on multi-chip module (MCM) design which relates to System in Package (SiP) technology. This kind of electronic circuit board design has created an enormous market which will see lots of change over the next decade in electronics devices.
Originally circuit board design was much more complex with different components spread around the board with more wiring. This meant that there was more expertise needed in the testing phase, and more outsourcing.
Over the past decade system in package design has created much less complex RF design boards. This has allowed different components to all be stacked into a single package. This technology came about because of the necessity for smaller, more portable electronics devices. These devices such as mobile phones require an antenna, radio, and various other components to be installed in a small unit.
As mobile phones became more complex the design became more and more difficult. Then multi-chip module technology was required in order to keep the size down. This means that everything can now be housed in a single package. Mobile phones these days need to be able to connect to the internet, make crystal clear quality phone calls, and many other applications. System-in-Package design has allowed for this to become possible.
With these technologies there is less power used. There is a faster time-to-market for new products, and the lower prices were necessary to keep consumers happy. In the future most households appliances will have wireless capabilities. They will be using SiP and MCM design as it is cheaper and less complex than the previous circuit board methods.
In the future even the washing machines will need wireless. They will be able to report back to manufacturers when ever a default is detected. Multi-chip module technology is making the wireless revolution possible.
This was a guest article from Jo Jones.
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