This article will focus on multi-chip module (MCM) design which relates to System in Package (SiP) technology. This kind of electronic circuit board design has created an enormous market which will see lots of change over the next decade in electronics devices. Originally circuit board…
Tag: SiP
Glass has been found to be a known good substrate material. It is commonplace for it to be used in circuit board design in order to achieve efficient results. It goes hand-in-hand with system in package technology which is also making advances in efficiency for…
The use of Embedded Passives engineering alongside Procedure in Package(SiP) on the globe of handheld communications nowadays has paved the way in which for scaled-down more functional devices. The devices include better performance, speed as well as less energy consumption. Among the earliest mobile devices…